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Wolfspeed Expands Silicon Carbide Wafer Supply Agreements for High-Power Density Applications

by Anna

Wolfspeed, a prominent supplier of silicon carbide (SiC) technology, has announced expanded agreements with Infineon and another leading global semiconductor manufacturer to supply 150 mm SiC wafers. These wafers are critical for emerging high-power density applications such as e-mobility and energy storage.

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The extended agreement with Infineon, originally initiated in 2018, includes multi-year capacity reservations, enabling Infineon to secure essential SiC wafer supplies for its growth plans in electric vehicles (EVs), renewable energy, and other markets demanding high power density solutions.

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In a separate deal, Wolfspeed is set to expand an existing SiC supply agreement with another major semiconductor company, bringing the total value of the deal to $275 million. As part of this agreement, Wolfspeed will supply 150 mm SiC bare and epitaxial wafers.

These agreements underscore the sustained demand for high-performance, high-voltage SiC materials, driven by the increasing adoption of electric and hybrid-electric vehicles, renewable energy sources, and the electrification of the global economy.

Wolfspeed, formerly known as Cree, transformed its business at the end of the last decade to focus on being a leading SiC technology supplier. The company’s strategic bet on SiC technology has proven successful, aligning with the rapid global expansion of SiC material demand.

Wolfspeed’s President and CEO, Gregg Lowe, projects significant growth in the SiC device market, forecasting it to reach $20 billion per year by 2030. The company is poised to meet this growing demand, having announced the selection of North Carolina for a state-of-the-art SiC manufacturing facility. This facility, anticipated to increase SiC material production tenfold over current capacity, will prioritize larger 200 mm wafers for more efficient chip yields.

Infineon, a key partner in the SiC supply agreements, utilizes Wolfspeed’s SiC materials for its CoolSiC MOSFET devices and power modules. These components play a crucial role in power-dense applications, including renewable inverters, energy storage, EV motor/charging systems, and other high-power density applications.

The expanded agreements highlight the collaboration between Wolfspeed and Infineon, spanning over 20 years, and reinforce Infineon’s multi-source strategy to secure a long-term global supply of 150 mm and 200 mm SiC wafers. Silicon carbide remains a compelling choice for power-dense applications, offering high voltage withstand, efficiency, and reliability at elevated temperatures, contributing to lighter and more compact power system designs.

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