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Vitronics Soltec Redesigns ZEVAm+ Selective Soldering Machine to Accommodate Larger Board Sizes

by Anna

Vitronics Soltec has unveiled a significant enhancement to its ZEVAm+ Selective Soldering Machine, making it compatible with board sizes up to 510mm x 510mm (20 x 20 inches). This redesign is primarily driven by the growing demand in the automotive and electric vehicle (EV) industries for larger board dimensions.

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Designed with the needs of high-mix, low-volume manufacturers in mind, the upgraded ZEVAm+ offers several unique advantages, particularly for fine-pitch selective soldering applications. One of the major challenges in such applications is solder bridging, which can lead to defects on boards with fine-pitch components.

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The ZEVAm+’s standout feature is its patented Bridge Prevention Technology, which functions as a hot nitrogen knife to effectively prevent solder bridging, even with small pitch components as close as 1mm (40mil) pin-to-pin distance, even when dealing with longer leads and increased drag speed.

Bridge Prevention Technology brings the added benefit of enabling the use of maintenance-free non-wettable nozzles, ensuring consistent soldering results over time. These nozzles, 3D printed out of stainless steel and hard chromized, provide infinite longevity without maintenance requirements. This setup ensures that the nitrogen flow maintains a fixed position relative to the solder wave, resulting in highly repeatable bridge prevention.

In addition to its advanced bridge prevention capabilities, the ZEVAm+ is equipped with a high-frequency drop-jet fluxer. This fluxer technology delivers a broader range of flux droplets, enhances accuracy, and reduces cycle times. Closed-loop flux volume control is also available, further enhancing consistency and traceability. Additionally, a second flux tank allows for refill without interrupting the production process.

The ZEVAm+ Selective Soldering Machine is specifically designed to optimize yields in high-mix, low-volume, and fine-pitch applications. With this latest enhancement, manufacturers now have access to all of these advantages while accommodating larger board sizes.

ITW EAE, a division of Illinois Tool Works, Inc., is a global leader in process knowledge, services, and the manufacture of capital equipment used in the printed circuit board assembly and semiconductor industries. The division brings together renowned brands in electronics assembly equipment, including MPM Printers, Camalot Dispensers, Electrovert Cleaners and Soldering Solutions, Vitronics Soltec Soldering Solutions, and Despatch Thermal Processing Technology.

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